The **ATS-17F-09-C2-R0** is a specific high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" heat sink assembly line, designed for cooling integrated circuits (ICs) and other electronic surface-mount components. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Component Type** | Heat Sink Assembly | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic Pins & Springs) | | **Thermal Resistance** | 10.58 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | | **Pitch** | Fine Pitch (Rectangular Pattern) | --- ## 2. Key Electronic & Mechanical Features ### A. Thermal Performance The heat sink is designed to dissipate heat generated by processors, FPGAs, or GPUs. * **Thermal Resistance:** It reduces the temperature of the chip junction by providing a low-resistance path to the ambient air. * **Airflow Optimization:** The "Fine Pitch" fin design is optimized for environments with high-velocity airflow, maximizing surface area contact. ### B. pushPIN™ Attachment System Unlike adhesive-based heat sinks, the **-R0** suffix indicates a push-pin mounting mechanism: * **Reliability:** Provides constant pressure (preload) for better thermal interface material (TIM) performance. * **Durability:** Ensures the heat sink does not shift under mechanical shock or vibration, which is critical for industrial electronics. * **Compression Springs:** Uses a brass or plastic pin with a stainless steel spring to secure the sink to pre-drilled holes in the PCB. ### C. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Coating:** This is not just aesthetic; the anodization increases the emissivity of the surface (improving radiation heat transfer) and provides electrical insulation and corrosion resistance. --- ## 3. Naming Convention Breakdown Understanding the part number helps in identifying the specific electronic application: | Segment | Meaning | | :--- | :--- | | **ATS-17** | Series Identifier (Advanced Thermal Solutions) | | **F** | Fin Style (F = Fine) | | **09** | Size/Configuration code | | **C2** | Thermal Interface Material (Typically T766 or similar pre-applied phase change material) | | **R0** | RoHS Compliant / Revision Status | --- ## 4. Application Use Cases This part is commonly found in: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial motherboards. * **Power Supplies:** Cooling MOSFETs or power regulators.