The **ATS-17F-100-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** designed by Advanced Thermal Solutions (ATS). It is used to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the mechanical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Heat Sink Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions** | 45mm x 45mm x 25mm | | **Fin Style** | XCUT (Straight Fins) | | **Thermal Resistance** | 4.84°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Electronic Component Breakdown #### A. The Heat Sink Body The body is made of **Blue Anodized Aluminum**. Aluminum is used for its high thermal conductivity and lightweight properties. The "XCUT" design increases the surface area for convective heat transfer while allowing for multi-directional airflow, which is critical in dense electronic enclosures. #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the **ATS-17F-100-C2-R0** uses a mechanical attachment: * **Push-Pins:** Made of brass, these fit into pre-drilled holes on the Printed Circuit Board (PCB). * **Compression Springs:** These provide a precise amount of downward force (pressure) to ensure maximum contact between the heat sink and the electronic chip. #### C. Thermal Interface Material (TIM) The part number suffix `-R0` indicates it comes with **T766** pre-applied. In electronics, the TIM is crucial because it fills microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance. --- ### 3. Application Use Cases This specific part is typically found in: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Industrial PCs:** Ensuring stability in high-temperature environments. * **Power Supplies:** Cooling voltage regulators or MOSFETs. ---