The **ATS-17F-102-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for secure and efficient cooling of integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table highlights the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Base Dimensions** | 45mm x 45mm | | **Height** | 25mm | | **Fin Style** | Fine Pitch (Straight Fins) | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 5.24 °C/W (at 100 LFM) to 1.58 °C/W (at 700 LFM) | --- ### 2. Component Breakdown The part is comprised of three main electronic/mechanical sub-elements: #### A. The Heat Sink Body * **Design:** It utilizes a "Fine Pitch" fin array, which increases the surface area for heat dissipation. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766** (or similar) thermal phase-change material to ensure no air gaps exist between the chip and the aluminum base. #### B. The pushPIN™ Attachment * **Spring-Loaded Bolts:** Instead of adhesive tape, it uses two mechanical pins with compression springs. * **Reliability:** This provides consistent downward pressure (clamping force), which is critical for maintaining thermal contact during vibration or thermal expansion. #### C. The Blue Anodized Coating * **Function:** Beyond aesthetics, the anodization protects the aluminum from oxidation and provides a small increase in emissivity, slightly improving radiant heat transfer. --- ### 3. Part Number Decoder The nomenclature **ATS-17F-102-C2-R0** breaks down as follows: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **17:** Series identifier. * **F:** Fin pitch/style. * **102:** Specific size/geometry configuration. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision/Packaging code. --- ### 4. Application Usage This part is typically used in the following electronic environments: * **Networking Gear:** Cooling high-speed switches or routers. * **Industrial PCs:** Maintaining stability in fanless or high-airflow enclosures. * **Embedded Systems:** Protecting power-dense processors from thermal throttling.