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  • ATS-17F-11-C2-R0

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    The **ATS-17F-11-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their *push-pin* attachment line, designed for cooling electronic components like CPUs, GPUs, or high-power ASICs. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 10.00mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 18.74°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Component Breakdown ### A. The Heat Sink Body The body is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The low profile (10mm height) makes it ideal for dense server environments or low-profile enclosures where vertical space is limited. ### B. The Attachment System (Push-Pin) Instead of adhesive tapes, this model uses a mechanical **Push-Pin and Spring** assembly: * **Brass Push-Pins:** Provide a secure, vibration-resistant connection to the PCB. * **Compression Springs:** Ensure consistent downward pressure on the electronic chip, which is critical for maximizing heat transfer. ### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that the unit comes with **T766** phase-change material pre-applied to the base. This fills the microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance. --- ## 3. Performance Analysis The efficiency of this heat sink is highly dependent on the velocity of the airflow (Measured in Linear Feet per Minute - LFM): * **@ 100 LFM:** 18.74°C/W (High resistance, requires more cooling) * **@ 400 LFM:** 6.11°C/W (Highly efficient cooling) * **@ 700 LFM:** 4.10°C/W (Peak performance) --- ## 4. Part Number Breakdown The nomenclature follows the standard ATS format: * **ATS:** Manufacturer (Advanced Thermal Solutions) * **17:** Series identifier * **F:** Fin pitch/Density * **11:** Fin height/Style index * **C2:** Thermal Interface Material code (T766) * **R0:** Revision/Packaging code
    ✨ Follow-up Questions
    • ⤷ How do I determine the correct hole pattern on my PCB for this push-pin heat sink?
    • ⤷ What are the advantages of using T766 thermal material over standard thermal grease?
    • ⤷ Can this heat sink be used for passive cooling without a fan?