ATS-17F-11-C2-R0
AI

The **ATS-17F-11-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their *push-pin* attachment line, designed for cooling electronic components like CPUs, GPUs, or high-power ASICs.
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## 1. Technical Specifications
Below are the primary physical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 10.00mm |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | 18.74°C/W (at 100 LFM) |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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## 2. Key Component Breakdown
### A. The Heat Sink Body
The body is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The low profile (10mm height) makes it ideal for dense server environments or low-profile enclosures where vertical space is limited.
### B. The Attachment System (Push-Pin)
Instead of adhesive tapes, this model uses a mechanical **Push-Pin and Spring** assembly:
* **Brass Push-Pins:** Provide a secure, vibration-resistant connection to the PCB.
* **Compression Springs:** Ensure consistent downward pressure on the electronic chip, which is critical for maximizing heat transfer.
### C. Thermal Interface Material (TIM)
The "C2" in the part number indicates that the unit comes with **T766** phase-change material pre-applied to the base. This fills the microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance.
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## 3. Performance Analysis
The efficiency of this heat sink is highly dependent on the velocity of the airflow (Measured in Linear Feet per Minute - LFM):
* **@ 100 LFM:** 18.74°C/W (High resistance, requires more cooling)
* **@ 400 LFM:** 6.11°C/W (Highly efficient cooling)
* **@ 700 LFM:** 4.10°C/W (Peak performance)
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## 4. Part Number Breakdown
The nomenclature follows the standard ATS format:
* **ATS:** Manufacturer (Advanced Thermal Solutions)
* **17:** Series identifier
* **F:** Fin pitch/Density
* **11:** Fin height/Style index
* **C2:** Thermal Interface Material code (T766)
* **R0:** Revision/Packaging code
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How do I determine the correct hole pattern on my PCB for this push-pin heat sink?
- ⤷ What are the advantages of using T766 thermal material over standard thermal grease?
- ⤷ Can this heat sink be used for passive cooling without a fan?