The **ATS-17F-116-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **push-pin** attachment series, specifically designed for cooling electronic components like CPUs, GPUs, or high-power ASICs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 4.14°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 35.00mm | | **Fin Style** | Straight Fin | --- ### 2. Physical Design Components 1. **Heat Sink Body:** Extruded aluminum provides a high surface-area-to-volume ratio. The straight fin design is optimized for unidirectional airflow. 2. **Push-Pins:** These provide the mechanical force needed to secure the heat sink to the PCB. They are pre-assembled with a spring to ensure consistent pressure (load) on the component. 3. **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is a "phase-change" or high-performance thermal pad that fills microscopic air gaps between the chip and the metal. --- ### 3. Thermal Performance Data Performance varies based on the airflow (Linear Feet per Minute - LFM) within the system enclosure: | Airflow (LFM) | Thermal Resistance (°C/W) | Pressure Drop (in-H2O) | | :--- | :--- | :--- | | 100 (Unducted) | 7.03 | 0.05 | | 200 (Unducted) | 4.14 | 0.16 | | 300 (Unducted) | 3.28 | 0.27 | | 500 (Unducted) | 2.50 | 0.52 | --- ### 4. Part Number Breakdown (ATS-17F-116-C2-R0) * **ATS:** Advanced Thermal Solutions (Manufacturer). * **17F:** Series identifier (Push-Pin style). * **116:** Specific dimension/geometry code. * **C2:** Blue Anodized finish. * **R0:** Revision code (Standard RoHS compliant). --- ### 5. Application Usage This component is typically found in: * **Telecommunications:** Cooling signal processors. * **Industrial PCs:** Thermal management for embedded controllers. * **Networking:** Cooling routers and switches where height (35mm) is permissible.