## Technical Analysis: ATS-17F-117-C2-R0 The **ATS-17F-117-C2-R0** is a high-performance **Heat Sink** assembly manufactured by Advanced Thermal Solutions (ATS). It is specifically designed for cooling electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. General Specifications Below is the technical breakdown of the part based on its model numbering and manufacturer data: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass/Plastic) | | **Thermal Resistance** | 10.48 °C/W (Unducted Flow @ 100 LFM) | --- ### 2. Physical Dimensions This heat sink belongs to the "Mini" or low-profile category, suitable for tight PCB layouts. * **Size (L x W):** 45mm x 45mm * **Height:** 12.7mm (Low Profile) * **Pitch (Hole-to-Hole):** 38mm x 38mm * **Weight:** ~25 grams --- ### 3. Key Electronic Components & Design Features The "electronic" functionality of this part relates to its thermal management properties. #### A. Fin Design (XC Cut) The unit uses a **Cross-Cut (XC)** fin pattern. Unlike straight fins, cross-cut fins allow for multidirectional airflow. This is crucial in dense electronic enclosures where airflow might not be strictly linear. #### B. Push-Pin Attachment The `-R0` suffix indicates the inclusion of the **push-pin and spring assembly**. * **Springs:** Pre-assembled with a stainless steel or brass compression spring. * **Reliability:** Ensures consistent pressure between the heat sink and the chip to maximize thermal transfer. #### C. Thermal Interface Material (TIM) * **Type:** Pre-applied **T766** phase-change material or thermal grease. * **Function:** Fills microscopic air gaps between the component die and the heat sink base. --- ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions | | **17** | Series Identifier | | **F** | Fin Pitch (Fine) | | **117** | Dimension/Design Code | | **C2** | Material/Color (Blue Anodized) | | **R0** | RoHS Compliant & Mounting Hardware Included | --- ### 5. Application Use Cases This heat sink is typically found in: * **Networking Gear:** Routers and switches. * **Industrial PCs:** Compact motherboards with limited vertical clearance. * **Power Electronics:** Cooling MOSFETs or small voltage regulators. ---