The **ATS-17F-119-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic integrated circuits (ICs). --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height** | 20.00 mm | | **Fin Style** | Fine-Pitch | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Unducted)** | 4.68 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.80 °C/W @ 100 LFM | --- ### 2. Key Electronic Components & Design The "electronic" functionality of this part is passive, focusing on heat dissipation to protect sensitive semiconductors. * **Heat Sink Body:** Constructed from high-grade aluminum to provide maximum thermal conductivity. * **Fin Design:** It uses a "Fine-Pitch" pattern. This increases the surface area significantly, allowing for better heat transfer to the surrounding air via convection. * **Attachment Mechanism:** It utilizes the proprietary **pushPIN™** system. This consists of: * **Brass Springs:** Provide a precise amount of downward pressure (compression force) to ensure a tight thermal interface. * **Plastic/Metal Pins:** Secure the sink through pre-drilled holes in the PCB. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with a high-performance thermal component (often Phase Change Material) to fill microscopic air gaps between the CPU/GPU and the heat sink. --- ### 3. Part Number Breakdown The nomenclature reveals specific details about the part: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **17** | Series Identifier | | **F** | Fin Pitch (F = Fine) | | **119** | Specific size/geometry identifier | | **C2** | Performance Grade / Material (T766 thermal grease or similar) | | **R0** | RoHS Compliant / Revision code | --- ### 4. Application This part is typically used in: * **Networking Equipment:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Cooling MOSFETs or small power modules where space is limited but thermal loads are high.