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  • ATS-17F-121-C2-R0

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    The **ATS-17F-121-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "push-pin" series designed for secure and efficient cooling of electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions** | 45mm x 45mm x 30mm | | **Thermal Resistance** | ~3.95°C/W (at 1.0 m/s airflow) | | **Fin Style** | Straight Fin | --- ### 2. Key Electronic Features The part number itself contains encoded information about its construction: * **Heat Sink Material:** High-grade aluminum provides a balance between weight and thermal conductivity. The **Blue Anodized** finish is not just for aesthetics; it increases surface emissivity and protects the aluminum from corrosion. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. T766 is a high-performance phase-change material that fills microscopic air gaps between the component (chip) and the heat sink, significantly improving heat transfer. * **Mechanical Security:** The "R0" suffix refers to the specific hardware kit. It uses brass push-pins and steel springs to ensure a consistent, high-pressure contact between the heat sink and the PCB, which is critical for maintaining thermal performance under vibration. --- ### 3. Application Use Cases This heat sink is designed for mid-to-high power density electronics where passive cooling is insufficient and forced airflow (fans) is available. * **Integrated Circuits (ICs):** Specifically designed for large BGAs and processors. * **Telecom Equipment:** Used in networking switches and routers. * **Industrial Controls:** Cooling for power modules in automation systems. --- ### 4. Thermal Performance Data Performance varies based on the velocity of the air passing through the fins: | Air Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | | 0.5 (Natural/Low) | 9.48 | | 1.0 | 3.95 | | 2.0 | 2.58 | | 3.0 | 2.09 |
    ✨ Follow-up Questions
    • ⤷ What are the dimensions of the mounting holes required for this push-pin heat sink?
    • ⤷ Can this heat sink be used without a fan (passive cooling)?
    • ⤷ What is the difference between the C2 and C1 versions of ATS heat sinks?