ATS-17F-121-C2-R0
AI

The **ATS-17F-121-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "push-pin" series designed for secure and efficient cooling of electronic components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Dimensions** | 45mm x 45mm x 30mm |
| **Thermal Resistance** | ~3.95°C/W (at 1.0 m/s airflow) |
| **Fin Style** | Straight Fin |
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### 2. Key Electronic Features
The part number itself contains encoded information about its construction:
* **Heat Sink Material:** High-grade aluminum provides a balance between weight and thermal conductivity. The **Blue Anodized** finish is not just for aesthetics; it increases surface emissivity and protects the aluminum from corrosion.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. T766 is a high-performance phase-change material that fills microscopic air gaps between the component (chip) and the heat sink, significantly improving heat transfer.
* **Mechanical Security:** The "R0" suffix refers to the specific hardware kit. It uses brass push-pins and steel springs to ensure a consistent, high-pressure contact between the heat sink and the PCB, which is critical for maintaining thermal performance under vibration.
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### 3. Application Use Cases
This heat sink is designed for mid-to-high power density electronics where passive cooling is insufficient and forced airflow (fans) is available.
* **Integrated Circuits (ICs):** Specifically designed for large BGAs and processors.
* **Telecom Equipment:** Used in networking switches and routers.
* **Industrial Controls:** Cooling for power modules in automation systems.
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### 4. Thermal Performance Data
Performance varies based on the velocity of the air passing through the fins:
| Air Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 0.5 (Natural/Low) | 9.48 |
| 1.0 | 3.95 |
| 2.0 | 2.58 |
| 3.0 | 2.09 |
- ⤷
What are the dimensions of the mounting holes required for this push-pin heat sink?
- ⤷ Can this heat sink be used without a fan (passive cooling)?
- ⤷ What is the difference between the C2 and C1 versions of ATS heat sinks?