The **ATS-17F-128-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heatsink** designed by Advanced Thermal Solutions (ATS). It is typically used for cooling integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The part number provides specific information regarding its dimensions, material, and attachment method. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Dimensions** | 54.00mm x 54.00mm | | **Height** | 25.00mm (Fin Height) | | **Thermal Resistance** | 2.91°C/W (at 100 LFM) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | --- ## 2. Key Electronic & Mechanical Components ### A. Fin Design (High-Performance Pattern) The heatsink features a **Straight Fin** or **Cross-Cut** geometry. This design maximizes surface area to allow heat to dissipate into the surrounding air via convection. The 25mm height is optimized for mid-to-high profile enclosures where airflow is consistent. ### B. Push-Pin Attachment System Instead of using messy thermal adhesives or permanent epoxy, this part uses a mechanical push-pin system: * **Compression Spring:** Ensures a precise amount of downward pressure (load) is applied to the chip, improving thermal contact without cracking the silicon die. * **Pre-drilled Holes:** Requires specific PCB hole spacing (typically 47.00mm for this series) to secure the pins. ### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of **Thermal Interface Material** pre-applied to the base: * **Type:** T766 (or equivalent high-performance phase-change material/grease). * **Function:** Fills microscopic air gaps between the chip surface and the heatsink base to minimize thermal impedance. --- ## 3. Thermal Performance Data Performance varies based on the airflow (velocity) provided by the system fans. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 2.91 | | 300 (1.5 m/s) | 1.56 | | 500 (2.5 m/s) | 1.19 | --- ## 4. Application Use-Cases * **Telecommunications:** Cooling high-speed processors in routers and switches. * **Industrial PCs:** Maintaining stable temperatures in embedded systems. * **Power Supplies:** Heat dissipation for MOSFETs or power regulators. ---