### Analysis of ATS-17F-137-C2-R0 The **ATS-17F-137-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** Heat Sink Assembly series, designed for thermal management of semiconductors and integrated circuits. --- ### 1. Technical Specifications This component is a high-performance heat sink designed for fine-pitch applications. Below are the primary specifications: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ | | **Thermal Resistance (Flowing)** | 1.83 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 18.30 °C/W | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Physical Dimensions The part follows a square-profile design optimized for space-constrained PCB layouts. * **Length (A):** 25.00 mm * **Width (B):** 25.00 mm * **Height (C):** 10.00 mm * **Pitch (E):** 30.00 mm * **Pitch (F):** 30.00 mm --- ### 3. Key Electronic/Thermal Features * **pushPIN™ Attachment:** This system features a flexible, pre-assembled attachment mechanism. It uses a compression spring and a plastic pin to provide uniform pressure across the component, ensuring optimal thermal contact. * **Fine-Pitch Fin Design:** The "F" in the part number denotes a fine-pitch fin pattern. This increases the surface area for heat dissipation, making it suitable for high-density electronic assemblies where airflow might be restricted. * **T766 Interface Material:** This is a high-performance thermal grease or phase-change material applied to the base. It fills microscopic air gaps between the heat sink and the chip to lower thermal resistance. * **Compliance:** The part is **RoHS-6** and **REACH** compliant, meeting international standards for hazardous substance restrictions in electronics. --- ### 4. Part Number Breakdown To understand the specific configuration, here is the naming convention for this part: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **17** | Series Number | | **F** | Fin Pitch (Fine Pitch) | | **137** | Specific Design/Dimension Identifier | | **C2** | Performance Grade / Material Variant | | **R0** | Revision Level | --- ### 5. Application Usage This heat sink is typically used for: * **BGA Packages:** cooling Ball Grid Array processors. * **Network Switches:** Management of high-speed data chips. * **Embedded Systems:** Industrial PCs where vertical clearance is limited (only 10mm high).