The **ATS-17F-145-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for efficient cooling of electronic components like CPUs, GPUs, or power transistors. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass) with Compression Spring | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 2.90°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 30.00mm | | **Base Shape** | Square | --- ## 2. Key Components & Materials ### A. The Heat Sink Body * **Material:** Extruded Aluminum. Aluminum is chosen for its excellent thermal conductivity and lightweight properties. * **Fin Style:** The "Straight Fin" design allows for maximum surface area while facilitating high airflow through the device, typically from a nearby cooling fan. * **Finish:** **Blue Anodized**. This chemical treatment prevents corrosion and slightly increases surface emissivity for better heat radiation. ### B. Attachment Mechanism (Push-Pins) The "R0" suffix refers to the specific attachment kit included: * **Push-Pins:** Made of brass. These are designed to be pushed through pre-drilled holes in the Printed Circuit Board (PCB). * **Springs:** Provides a specific amount of compression force to ensure the heat sink makes a firm, flat contact with the electronic chip, minimizing the thermal air gap. ### C. Thermal Interface Material (TIM) * The product typically comes with a pre-applied **Thermal Phase Change Material** or a high-performance thermal pad on the base. This fills the microscopic gaps between the chip and the heat sink. --- ## 3. Thermal Performance (Airflow Data) Thermal resistance ($^\circ \text{C/W}$) determines how effectively the heat sink dissipates energy based on airflow velocity (measured in Linear Feet per Minute - LFM). | Air Velocity (LFM) | Thermal Resistance ($^\circ \text{C/W}$) | | :--- | :--- | | 200 (1.0 m/s) | 2.90 | | 300 (1.5 m/s) | 2.31 | | 400 (2.0 m/s) | 1.98 | | 600 (3.0 m/s) | 1.62 | --- ## 4. Typical Applications * **Embedded Systems:** Cooling microprocessors in industrial hardware. * **Telecommunications:** Used on high-speed data chips in routers or switches. * **Power Electronics:** Managing heat on VRMs (Voltage Regulator Modules).