The **ATS-17F-147-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is designed for high-density electronic cooling. --- ## 1. Component Specifications The following table highlights the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-17F-147-C3-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Fin Style** | Straight | | **Heat Sink Type** | Top Mount | | **Thermal Resistance** | 13.65°C/W (at 100 LFM) | --- ## 2. Key Features ### A. pushPIN™ Attachment System The "R0" at the end of the part number signifies the use of the ATS pushPIN™ system. This system includes: * **Flexible Springs:** Provides the necessary pressure to ensure a tight bond between the heat sink and the component (CPU, GPU, or FPGA). * **Secure Mounting:** Designed for easy installation and pre-drilled PCB holes, reducing the risk of component damage during assembly. ### B. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Coating:** Not only provides aesthetic value but also increases corrosion resistance and surface emissivity (improving radiation heat transfer). ### C. Thermal Performance This heat sink is optimized for **forced air** environments. As air velocity increases (measured in Linear Feet per Minute - LFM), the thermal resistance drops significantly: * **100 LFM:** 13.65°C/W * **300 LFM:** 5.69°C/W * **500 LFM:** 4.07°C/W --- ## 3. Dimensional Data The dimensions are critical for ensuring clearance on densely packed Printed Circuit Boards (PCBs). | Dimension | Value (mm) | | :--- | :--- | | **Length (A)** | 30.00 mm | | **Width (B)** | 30.00 mm | | **Height (C)** | 10.00 mm | | **Pitch (E)** | 35.00 mm | | **Pitch (F)** | 35.00 mm | --- ## 4. Typical Applications * **Integrated Circuits (ICs):** Cooling for small to mid-sized processors. * **Power Modules:** Dissipating heat from VRMs or MOSFETs. * **Telecommunications:** Used in routers and switches where airflow is managed by chassis fans. ---