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  • ATS-17F-151-C1-R0

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    The part number **ATS-17F-151-C1-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" attachment series designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the device: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 3.90°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 35.00 mm x 35.00 mm | | **Height (Fin Depth)** | 10.00 mm | | **Attachment Type** | Push Pin (Brass) | | **Thermal Interface Material** | T766 (Pre-applied Phase Change) | --- ### 2. Component Breakdown The part number can be decoded to understand the specific configuration: * **ATS-17F**: The series designation and size profile. * **151**: Represents the specific fin pattern and density. * **C1**: Indicates the material/finish (Blue Anodized Aluminum). * **R0**: Refers to the packaging and revision status. --- ### 3. Key Electronic Functions While this is a mechanical part, its role in an electronic system is critical for reliability: 1. **Thermal Dissipation**: It increases the surface area of a semiconductor package, allowing heat to transfer from the silicon die to the ambient air more efficiently. 2. **Thermal Interface Material (TIM)**: This specific model comes with **T766** pre-applied. This is a "Phase Change" material that softens at operating temperatures to fill microscopic air gaps between the heat sink and the chip. 3. **Mechanical Attachment**: It utilizes a brass push pin with a steel spring. This provides consistent pressure (clamping force) on the chip, which is vital for maintaining thermal contact without cracking the delicate electronic substrate. --- ### 4. Comparison of Thermal Performance Thermal resistance varies based on airflow velocity (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 3.90 | 2.36 | 1.88 | 1.63 |
    ✨ Follow-up Questions
    • ⤷ What are the benefits of using a blue anodized finish on a heat sink?
    • ⤷ How do I calculate if this heat sink is sufficient for a 10W processor?
    • ⤷ What is the difference between T766 and standard thermal grease?