ATS-17F-151-C1-R0
AI

The part number **ATS-17F-151-C1-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" attachment series designed for cooling electronic components like CPUs, GPUs, and FPGAs.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the device:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 3.90°C/W (Unducted Flow @ 100 LFM) |
| **Dimensions (L x W)** | 35.00 mm x 35.00 mm |
| **Height (Fin Depth)** | 10.00 mm |
| **Attachment Type** | Push Pin (Brass) |
| **Thermal Interface Material** | T766 (Pre-applied Phase Change) |
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### 2. Component Breakdown
The part number can be decoded to understand the specific configuration:
* **ATS-17F**: The series designation and size profile.
* **151**: Represents the specific fin pattern and density.
* **C1**: Indicates the material/finish (Blue Anodized Aluminum).
* **R0**: Refers to the packaging and revision status.
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### 3. Key Electronic Functions
While this is a mechanical part, its role in an electronic system is critical for reliability:
1. **Thermal Dissipation**: It increases the surface area of a semiconductor package, allowing heat to transfer from the silicon die to the ambient air more efficiently.
2. **Thermal Interface Material (TIM)**: This specific model comes with **T766** pre-applied. This is a "Phase Change" material that softens at operating temperatures to fill microscopic air gaps between the heat sink and the chip.
3. **Mechanical Attachment**: It utilizes a brass push pin with a steel spring. This provides consistent pressure (clamping force) on the chip, which is vital for maintaining thermal contact without cracking the delicate electronic substrate.
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### 4. Comparison of Thermal Performance
Thermal resistance varies based on airflow velocity (measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | 100 | 300 | 500 | 700 |
| :--- | :--- | :--- | :--- | :--- |
| **Thermal Resistance (°C/W)** | 3.90 | 2.36 | 1.88 | 1.63 |
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What are the benefits of using a blue anodized finish on a heat sink?
- ⤷ How do I calculate if this heat sink is sufficient for a 10W processor?
- ⤷ What is the difference between T766 and standard thermal grease?