ATS-17F-16-C2-R0
AI

The **ATS-17F-16-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### ## Technical Specifications
The following table summarizes the key physical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions (L x W)** | 54.00 mm x 54.00 mm |
| **Height** | 10.00 mm (Low Profile) |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Thermal Resistance** | 18.08 °C/W @ 100 LFM |
| **Fin Type** | XC (Extra Coarse) Square Fin |
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### ## Key Electronic Features
1. **High-Efficiency Fin Design:**
The "XC" square fin pattern provides a large surface area for heat dissipation while maintaining low pressure drop, making it ideal for systems with limited airflow.
2. **Thermal Interface Material (TIM):**
The "C2" suffix indicates that this part comes pre-applied with **T766 phase-change material**. This fills microscopic gaps between the heat sink and the electronic component to maximize heat transfer.
3. **Mechanical Attachment (pushPIN™):**
Unlike simple adhesive tapes, the push-pin mechanism provides a consistent and reliable downward force (pressure), ensuring optimal thermal contact over the lifespan of the device.
4. **Low Profile:**
With a height of only 10mm, it is designed for space-constrained electronic enclosures like 1U servers, laptops, or compact embedded systems.
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### ## Code Identification Breakdown
The part number can be decoded as follows:
```text
ATS - 17 - F - 16 - C2 - R0
| | | | | |
| | | | | └── Revision Code
| | | | └─────── Thermal Interface Material (T766)
| | | └──────────── Fin Pitch/Pattern Configuration
| | └───────────────── Heat Sink Height (F = 10mm)
| └────────────────────── Attachment Type (pushPIN)
└──────────────────────────── Manufacturer (Advanced Thermal Solutions)
```
- ⤷
What are the airflow requirements to reach the maximum thermal efficiency for this heat sink?
- ⤷ Can the push-pin attachment be used on standard PCB thicknesses?
- ⤷ How does blue anodizing affect the thermal performance compared to bare aluminum?