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  • ATS-17F-16-C2-R0

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    The **ATS-17F-16-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### ## Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W)** | 54.00 mm x 54.00 mm | | **Height** | 10.00 mm (Low Profile) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 18.08 °C/W @ 100 LFM | | **Fin Type** | XC (Extra Coarse) Square Fin | --- ### ## Key Electronic Features 1. **High-Efficiency Fin Design:** The "XC" square fin pattern provides a large surface area for heat dissipation while maintaining low pressure drop, making it ideal for systems with limited airflow. 2. **Thermal Interface Material (TIM):** The "C2" suffix indicates that this part comes pre-applied with **T766 phase-change material**. This fills microscopic gaps between the heat sink and the electronic component to maximize heat transfer. 3. **Mechanical Attachment (pushPIN™):** Unlike simple adhesive tapes, the push-pin mechanism provides a consistent and reliable downward force (pressure), ensuring optimal thermal contact over the lifespan of the device. 4. **Low Profile:** With a height of only 10mm, it is designed for space-constrained electronic enclosures like 1U servers, laptops, or compact embedded systems. --- ### ## Code Identification Breakdown The part number can be decoded as follows: ```text ATS - 17 - F - 16 - C2 - R0 | | | | | | | | | | | └── Revision Code | | | | └─────── Thermal Interface Material (T766) | | | └──────────── Fin Pitch/Pattern Configuration | | └───────────────── Heat Sink Height (F = 10mm) | └────────────────────── Attachment Type (pushPIN) └──────────────────────────── Manufacturer (Advanced Thermal Solutions) ```
    ✨ Follow-up Questions
    • ⤷ What are the airflow requirements to reach the maximum thermal efficiency for this heat sink?
    • ⤷ Can the push-pin attachment be used on standard PCB thicknesses?
    • ⤷ How does blue anodizing affect the thermal performance compared to bare aluminum?