The **ATS-17F-162-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 3.62°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Components & Design The ATS-17F-162-C2-R0 is engineered with specific electronic cooling requirements in mind: * **Heat Dissipation Surface:** The straight-fin design is optimized for high-airflow environments. The aluminum construction ensures rapid heat transfer from the electronic die to the ambient air. * **Push-Pin Attachment:** It uses a spring-loaded push-pin mechanism. This provides a consistent **clamping force** (pressure) against the chip, which is critical for maximizing the effectiveness of the Thermal Interface Material (TIM). * **Pre-applied TIM (T766):** The base comes pre-coated with T766, a phase-change thermal interface material. This fills microscopic air gaps between the heat sink and the electronic component to lower thermal impedance. * **Blue Anodized Finish:** Beyond aesthetics, the anodization protects the aluminum from corrosion and slightly increases surface emissivity for better radiation heat transfer. --- ### 3. Applications This part is commonly used to cool: 1. **Application Specific Integrated Circuits (ASICs)** 2. **Field Programmable Gate Arrays (FPGAs)** 3. **Power Converters** 4. **Network Processors** --- ### 4. Comparison of Airflow Performance The effectiveness of this heat sink changes based on the Linear Feet per Minute (LFM) of airflow provided by system fans: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200** | 3.62 | | **400** | 2.13 | | **600** | 1.72 |