The **ATS-17F-17-C2-R0** is a specific electronic component primarily classified as a **High-Performance Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to their "push pin" series designed for cooling Integrated Circuits (ICs) and other PCB components. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 7.54°C/W (at 1.0 m/s flow) | | **Dimensions (L x W x H)** | 54mm x 54mm x 12.7mm | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (High Performance Pre-applied) | --- ## 2. Key Electronic Features ### A. Thermal Management (C2 Series) The "C2" in the part number indicates a specific thermal profile and material grade. The fin geometry is optimized for **cross-flow ventilation**, allowing air to pass through from multiple directions, which is critical in dense electronic enclosures where airflow may be unpredictable. ### B. Attachment Mechanism (Push Pin) Unlike adhesive-based heat sinks, the **ATS-17F-17-C2-R0** uses a mechanical push-pin system: * **Reliability:** It provides consistent pressure (load) on the electronic component, ensuring maximum contact with the Thermal Interface Material (TIM). * **Reusability:** It can be removed for board repair without damaging the chip package. ### C. Thermal Interface Material (T766) The part comes pre-applied with **T766**, a high-quality phase-change or grease-like pad. In electronics, this fills the microscopic air gaps between the heat sink and the component (CPU, GPU, or FPGA), significantly reducing heat resistance. --- ## 3. Common Applications In the electronics industry, this part is typically used for: * **FPGA & ASIC Cooling:** High-speed processing units that generate significant heat. * **Network Switches:** Used on central processing chips within telecommunications hardware. * **Industrial Power Supplies:** Cooling power transistors and voltage regulators. ---