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  • ATS-17F-172-C2-R0

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    The **ATS-17F-172-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** designed by Advanced Thermal Solutions (ATS). It is engineered for cooling electronic components such as CPUs, GPUs, or high-speed chipsets. --- ## 1. Technical Specifications Below is a breakdown of the physical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Fin Type** | XC-Cut (Cross-Cut) | | **Dimensions** | 30.00mm x 30.00mm | | **Height** | 15.00mm | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Component Details ### A. The Heat Sink Body The "XC-Cut" design features straight fins that have been cut crosswise. This creates a matrix of pins/fins that allows for **multi-directional airflow**. This is crucial in dense electronic enclosures where airflow may not be strictly linear. ### B. Attachment Mechanism (Push-Pin) Instead of using adhesive tape or screws, this part uses a **Push-Pin and Spring** assembly: * **Plastic Push-Pins:** These snap into pre-drilled holes on the PCB (Printed Circuit Board). * **Compression Springs:** These ensure a consistent, high-pressure contact between the heat sink and the component, which optimizes heat transfer. ### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a phase-change material or high-performance grease that fills the microscopic air gaps between the chip and the heat sink, significantly reducing thermal resistance. --- ## 3. Part Number Decoder Understanding the "ATS-17F-172-C2-R0" nomenclature: * **ATS:** Advanced Thermal Solutions (Brand). * **17F:** Refers to the specific series of push-pin heat sinks. * **172:** Dimensional code relating to the 30x30x15mm size. * **C2:** Refers to the material and finish (Blue Anodized Aluminum). * **R0:** Revision code (Standard RoHS compliant version). --- ## 4. Application Use Cases This heat sink is typically found in: * **Networking Hardware:** Switches, routers, and gateways. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Cooling voltage regulators or MOSFETs.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the push-pins in this model?
    • ⤷ How does the thermal resistance of this heat sink change with different airflow speeds (LFM)?
    • ⤷ Can the pre-applied T766 thermal material be replaced with a different interface pad?