ATS-17F-172-C2-R0
AI

The **ATS-17F-172-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** designed by Advanced Thermal Solutions (ATS). It is engineered for cooling electronic components such as CPUs, GPUs, or high-speed chipsets.
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## 1. Technical Specifications
Below is a breakdown of the physical and thermal properties of this specific part number:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (Blue Anodized) |
| **Fin Type** | XC-Cut (Cross-Cut) |
| **Dimensions** | 30.00mm x 30.00mm |
| **Height** | 15.00mm |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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## 2. Key Component Details
### A. The Heat Sink Body
The "XC-Cut" design features straight fins that have been cut crosswise. This creates a matrix of pins/fins that allows for **multi-directional airflow**. This is crucial in dense electronic enclosures where airflow may not be strictly linear.
### B. Attachment Mechanism (Push-Pin)
Instead of using adhesive tape or screws, this part uses a **Push-Pin and Spring** assembly:
* **Plastic Push-Pins:** These snap into pre-drilled holes on the PCB (Printed Circuit Board).
* **Compression Springs:** These ensure a consistent, high-pressure contact between the heat sink and the component, which optimizes heat transfer.
### C. Thermal Interface Material (TIM)
The part comes with **T766** pre-applied to the base. This is a phase-change material or high-performance grease that fills the microscopic air gaps between the chip and the heat sink, significantly reducing thermal resistance.
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## 3. Part Number Decoder
Understanding the "ATS-17F-172-C2-R0" nomenclature:
* **ATS:** Advanced Thermal Solutions (Brand).
* **17F:** Refers to the specific series of push-pin heat sinks.
* **172:** Dimensional code relating to the 30x30x15mm size.
* **C2:** Refers to the material and finish (Blue Anodized Aluminum).
* **R0:** Revision code (Standard RoHS compliant version).
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## 4. Application Use Cases
This heat sink is typically found in:
* **Networking Hardware:** Switches, routers, and gateways.
* **Embedded Systems:** Industrial PCs and automation controllers.
* **Power Supplies:** Cooling voltage regulators or MOSFETs.
- ⤷
What are the PCB hole diameter requirements for the push-pins in this model?
- ⤷ How does the thermal resistance of this heat sink change with different airflow speeds (LFM)?
- ⤷ Can the pre-applied T766 thermal material be replaced with a different interface pad?