The **ATS-17F-174-C2-R0** is a high-performance **Heat Sink** assembly from Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for thermal management of electronic components like CPUs, GPUs, and FPGAs. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass with Plastic ends) | | **Thermal Resistance** | 4.02°C/W (at 200 LFM) | | **Dimensions (L x W)** | 30mm x 30mm | | **Height** | 35mm | | **Fin Type** | XC-Cut (Cross-Cut) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Electronic Features ### A. XC-Cut Fin Design Unlike standard straight-fin heat sinks, the XC-Cut pattern allows for **omni-directional airflow**. This means the heat sink can dissipate heat effectively regardless of the direction of the system's cooling fans. ### B. Push-Pin Attachment The part uses a mechanical push-pin mechanism. This provides: * **Constant Pressure:** Ensures maximum contact between the chip and the heat sink. * **Secure Mounting:** Reduces the risk of the heat sink shifting during vibration or shipping. * **Ease of Assembly:** No tools are required for installation into pre-drilled PCB holes. ### C. Thermal Interface Material (T766) The "C2" in the part number indicates it comes with **T766** pre-applied. This is a high-performance phase-change material that fills microscopic air gaps between the component and the heat sink, significantly lowering thermal resistance. --- ## 3. Component Dimensions Diagram The physical footprint is critical for PCB layout (all measurements in mm): | Part Dimension | Value | | :--- | :--- | | **Base Length** | 30.00 | | **Base Width** | 30.00 | | **Height** | 35.00 | | **Hole Spacing** | ~38.00 (Diagonal) | --- ## 4. Application Use Cases * **Embedded Systems:** Cooling microprocessors in tight enclosures. * **Telecommunications:** Dissipating heat from high-speed networking chips. * **Industrial PCs:** Providing ruggedized thermal management for logic controllers.