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  • ATS-17F-177-C2-R0

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    The **ATS-17F-177-C2-R0** is a high-performance electronic component specifically designed for thermal management. It is a **heat sink** manufactured by Advanced Thermal Solutions (ATS). --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Specification | Details | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 35.0mm x 35.0mm x 20.0mm | | **Thermal Resistance** | 6.18 °C/W (at 1.0 m/s airflow) | | **Flow Pattern** | Cross-cut (Multiple directions) | | **RoHS Status** | Compliant | --- ## 2. Key Electronic Features While the device itself is passive (non-powered), it is critical for the survival of active electronic parts: * **Heat Transfer Efficiency:** Designed for high-density electronic packaging where airflow may be limited. The cross-cut fin pattern allows for airflow from multiple directions. * **pushPIN™ Technology:** Uses a specialized attachment mechanism that includes a stainless steel spring. This ensures consistent pressure (clamping force) between the heat sink and the electronic component (like a BGA, CPU, or FPGA), maximizing thermal interface performance. * **Pre-Applied TIM:** These units typically come with a pre-applied **Thermal Interface Material (TIM)**, usually a phase-change material or high-performance thermal pad, to reduce assembly time and ensure low thermal impedance. --- ## 3. Applications in Electronics This specific heat sink is commonly found in the following sectors: 1. **Telecommunications:** Cooling of networking switches and routers. 2. **Embedded Systems:** Protecting industrial microprocessors. 3. **Power Supplies:** Dissipating heat from high-speed switching transistors (MOSFETs). 4. **Consumer Electronics:** Use in high-end computing peripherals. --- ## 4. Mechanical Drawing Overview * **Length/Width:** 35mm x 35mm (Standard square footprint). * **Height:** 20mm (Low profile, suitable for 1U or 2U rack-mounted systems). * **Hole Pattern:** Specifically designed for standard PCB layouts to ensure the push-pins align with the board's mounting holes.
    ✨ Follow-up Questions
    • ⤷ What are the advantages of pushPIN attachment over adhesive tapes?
    • ⤷ How does the 'Blue Anodized' finish affect the thermal performance?
    • ⤷ Can this heat sink be used with a custom fan assembly?