ATS-17F-177-C2-R0
AI

The **ATS-17F-177-C2-R0** is a high-performance electronic component specifically designed for thermal management. It is a **heat sink** manufactured by Advanced Thermal Solutions (ATS).
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## 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Specification | Details |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions** | 35.0mm x 35.0mm x 20.0mm |
| **Thermal Resistance** | 6.18 °C/W (at 1.0 m/s airflow) |
| **Flow Pattern** | Cross-cut (Multiple directions) |
| **RoHS Status** | Compliant |
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## 2. Key Electronic Features
While the device itself is passive (non-powered), it is critical for the survival of active electronic parts:
* **Heat Transfer Efficiency:** Designed for high-density electronic packaging where airflow may be limited. The cross-cut fin pattern allows for airflow from multiple directions.
* **pushPIN™ Technology:** Uses a specialized attachment mechanism that includes a stainless steel spring. This ensures consistent pressure (clamping force) between the heat sink and the electronic component (like a BGA, CPU, or FPGA), maximizing thermal interface performance.
* **Pre-Applied TIM:** These units typically come with a pre-applied **Thermal Interface Material (TIM)**, usually a phase-change material or high-performance thermal pad, to reduce assembly time and ensure low thermal impedance.
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## 3. Applications in Electronics
This specific heat sink is commonly found in the following sectors:
1. **Telecommunications:** Cooling of networking switches and routers.
2. **Embedded Systems:** Protecting industrial microprocessors.
3. **Power Supplies:** Dissipating heat from high-speed switching transistors (MOSFETs).
4. **Consumer Electronics:** Use in high-end computing peripherals.
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## 4. Mechanical Drawing Overview
* **Length/Width:** 35mm x 35mm (Standard square footprint).
* **Height:** 20mm (Low profile, suitable for 1U or 2U rack-mounted systems).
* **Hole Pattern:** Specifically designed for standard PCB layouts to ensure the push-pins align with the board's mounting holes.
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What are the advantages of pushPIN attachment over adhesive tapes?
- ⤷ How does the 'Blue Anodized' finish affect the thermal performance?
- ⤷ Can this heat sink be used with a custom fan assembly?