The **ATS-17F-181-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions and thermal characteristics of the push-pin heat sink. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 11.95°C/W (at 1.0 m/s air flow) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Attachment Type** | Push-Pin (2-Pin) | | **Spring Type** | Compression Spring (Brass) | | **Thermal Interface (TIM)** | T766 (High Performance Phase Change) | --- ### Key Electronic & Mechanical Components #### 1. The Fin Structure (XC Cut) The "181" series uses a **cross-cut (XC)** fin pattern. Unlike straight fins, cross-cut fins allow air to flow through the heat sink from multiple directions. This makes it ideal for electronic enclosures where the direction of airflow from cooling fans might be turbulent or inconsistent. #### 2. Push-Pin Attachment Mechanism This part uses a mechanical fastening system rather than adhesive tape. * **Electronic Safety:** Mechanical pins ensure the heat sink stays mounted even under high vibration or extreme heat, where adhesives might fail. * **Hole Pattern:** It requires pre-drilled holes on the PCB (Printed Circuit Board) with specific spacing (usually 33mm centers for this model). #### 3. Thermal Interface Material (TIM) The part comes pre-applied with **T766**. In electronics, the TIM is crucial because it fills the microscopic air gaps between the hot component (the chip) and the metal heat sink. T766 is a phase-change material that offers low thermal impedance. --- ### Application in Circuitry The ATS-17F-181-C2-R0 is typically used for: * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Networking switches and routers. * **Power Supplies:** Cooling voltage regulators and high-speed MOSFETs. ---