The **ATS-17F-188-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and surface-mount components. --- ### Technical Specifications Below are the primary electronic and physical specifications for this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Thermal Resistance** | 6.67°C/W (Unducted Flow @ 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Fin Style** | Fine Pitch (Cross-Cut) | --- ### Key Components & Features #### 1. Push-Pin Attachment Mechanism This part utilizes a specific **Push-Pin** mounting system. - **Spring Loading:** It features a pre-assembled compression spring that provides precise pressure to ensure maximum contact between the heat sink and the component. - **Hardware:** It typically uses brass or plastic pins that snap into pre-drilled holes on the PCB. #### 2. Thermal Interface Material (TIM) The "C2" in the part number indicates that this unit comes pre-applied with **ATS-PPS-02** thermal interface material. This is a high-performance thermal pad/grease that fills microscopic air gaps between the chip and the heat sink to improve heat transfer. #### 3. Fin Design (Fine Pitch) The heat sink uses a **cross-cut** or square pin-fin pattern. This design is optimized for: - **Omnidirectional Airflow:** It can receive cooling air from any direction, unlike straight-fin heat sinks. - **Increased Surface Area:** Maximizes the area available for heat dissipation within a low 15mm profile. --- ### Applications in Electronics This specific heat sink is commonly found in: * **Networking Gear:** Routers, switches, and modems. * **Embedded Systems:** High-speed microprocessors and FPGAs. * **Power Supplies:** Cooling MOSFETs or power regulators.