The **ATS-17F-19-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and surface-mount devices. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-17F-19-C2-R0 | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Dimensions (L x W)** | 54mm x 54mm | | **Height** | 20mm | | **Fin Pattern** | COARSE-PITCH | | **Fin Type** | STRAIGHT | | **Thermal Resistance** | 0.97 °C/W (at 200 LFM) | | **Finish** | Blue Anodized | --- ### Core Components and Features #### 1. Heat Sink Body The body is made of **Aluminum 6063**, which is the industry standard for thermal conductivity, structural strength, and lightweight properties. The "Straight-Fin" design allows for efficient airflow, particularly in systems with a defined air path. #### 2. pushPIN™ Attachment System One of the defining "electronic parts" of this assembly is the attachment mechanism. Unlike simple adhesive tapes, the pushPIN™ system uses: * **Springs:** Pre-assembled to provide the precise "Firm Force" required for optimal thermal contact. * **Push Pins:** Durable plastic (or metal) pins that lock into the PCB holes, ensuring the heatsink stays secure during vibration or shipping. #### 3. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with **T766 phase-change material** or a similar high-performance thermal pad pre-applied to the base. This ensures there are no microscopic air gaps between the electronic chip and the aluminum base. --- ### Usage in Electronics This component is commonly found in the following applications: * **Networking Gear:** Switches and Routers. * **Power Supplies:** Heat dissipation for MOSFETs and power ICs. * **Processing Units:** Cooling for FPGAs and specialized ASICs.