The **ATS-17F-191-C2-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define size, material, and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ Heat Sink | | **Type** | Pin Fin Heat Sink | | **Attachment Method** | Push-Pin (2-Push Pin Design) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 2.90°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Physical Dimensions Precision measurements are critical for ensuring the heat sink fits within the PCB layout and does not interfere with surrounding components. | Dimension | Measurement | | :--- | :--- | | **Width (X)** | 45.00 mm | | **Length (Y)** | 45.00 mm | | **Height (Z)** | 20.00 mm | | **Pitch (A)** | 38.00 mm (Distance between pins) | | **Pitch (B)** | 38.00 mm (Distance between pins) | --- ## 3. Key Electronic Functions & Features ### A. Material & Surface Treatment * **Aluminum 6063:** This alloy is used for its excellent thermal conductivity and structural integrity. * **Blue Anodizing:** The surface treatment is not just aesthetic; it increases surface emissivity and provides corrosion resistance. ### B. Thermal Performance The "Pin Fin" design creates high turbulence in the airflow, which significantly enhances heat transfer compared to standard straight-fin heat sinks, especially in low-velocity air environments. ### C. Attachment Mechanism (Push-Pin) The heat sink utilizes a **Push-Pin** assembly with a brass spring. * **Benefits:** It provides uniform pressure across the component to ensure maximum contact with the Thermal Interface Material (TIM). * **Ease of Use:** It allows for quick, tool-free installation onto pre-drilled PCB holes. ### D. T766 Interface Material The unit comes with a pre-applied **T766 phase-change material**. This eliminates the need for manual thermal paste application, ensuring a consistent and high-quality thermal bond between the chip and the heat sink. --- ## 4. Application Use Cases * **Networking Hardware:** Switches and routers where airflow may be multidirectional. * **Embedded Systems:** Industrial PCs requiring robust cooling in a small footprint. * **Power Electronics:** Cooling MOSFETs or Voltage Regulators.