The **ATS-17F-196-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure system stability and longevity. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height** | 10.00mm | | **Pitch** | Fine-Pitch | | **Thermal Resistance** | 18.11°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Key Electronic Components & Design The "pushPIN™" system integrated into this part includes several critical sub-components designed for electronic reliability: * **Heat Sink Body:** A fine-pitch fin pattern designed to maximize surface area for convective cooling while maintaining a low profile (10mm). * **Push-Pins:** Usually made of Nylon or Brass, these provide a secure mechanical attachment to the PCB (Printed Circuit Board). * **Compression Springs:** These ensure constant pressure (Force) between the heat sink and the electronic chip, which is vital for optimal thermal interface material (TIM) performance. * **Thermal Interface Material (TIM):** This part typically comes with **T766** pre-applied, which is a high-performance thermal grease that fills microscopic air gaps between the component and the heat sink. --- ### 3. Part Number Breakdown The part number follows a specific nomenclature used by ATS: 1. **ATS-17**: The specific family or series designation. 2. **F**: Indicates a "Fine" pitch fin configuration. 3. **196**: Represents the specific dimensions and surface area profile. 4. **C2**: Refers to the material and finish (Blue Anodized Aluminum). 5. **R0**: Refers to the packaging and revision status. --- ### 4. Typical Applications * **Embedded Systems:** For cooling SoCs (System on Chips) in compact enclosures. * **Telecommunications:** Used on high-speed networking PCBAs. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.