The **ATS-17F-20-C2-R0** is a specific electronic component belonging to the thermal management category. It is a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**, designed for cooling electronic components such as CPUs, GPUs, or power transistors. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ Heat Sink Assembly | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 7.14°C/W (Unducted Flow @ 100 LFM) | | **Base Dimensions** | 45mm x 45mm | | **Height** | 25mm | | **Fin Style** | Straight Fin | --- ## 2. Component Breakdown Understanding the "Electronic Parts" aspect requires looking at the mechanical-thermal interface: ### A. The Heat Sink Body * **Straight Fin Design:** This model features vertical fins that allow air to pass through linearly. It is most effective in environments with a dedicated fan or directional airflow. * **Material:** Made of high-grade aluminum for a balance between weight and thermal conductivity. The **Blue Anodized** finish increases surface emissivity and protects against corrosion. ### B. Attachment Mechanism (pushPIN™) Unlike simple adhesive heat sinks, this part uses a mechanical fastening system: * **Push Pins:** These are inserted through pre-drilled holes in the PCB. * **Springs:** They provide precise, consistent pressure across the component (TIM), ensuring optimal heat transfer without cracking the silicon die. ### C. Thermal Interface Material (TIM) * **Pre-applied T766:** The "-R0" designation typically indicates that the part comes with a pre-applied Phase Change Material or high-performance thermal pad. This eliminates the need for manual thermal paste application. --- ## 3. Application Use Cases This part is commonly found in the following electronic assemblies: 1. **Embedded Systems:** For cooling high-speed processors in industrial PCs. 2. **Telecommunications:** Cooling ASICs in networking switches and routers. 3. **Power Electronics:** Dissipating heat from large MOSFETs or IGBT modules. --- ## 4. Performance Data (Airflow) Thermal resistance varies based on the velocity of the air moving through the fins: | Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Resist (°C/W)** | 7.14 | 2.93 | 1.81 | 1.44 |