The **ATS-17F-202-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Body), Copper (Optional Base) | | **Attachment Method** | Push Pin (with Springs) | | **Fin Style** | XCUT (Straight Fins) | | **Dimensions** | 50mm x 50mm x 15mm | | **Thermal Resistance** | ~14.0°C/W (Unducted) | | **Finish** | Blue Anodized | --- ## 2. Key Electronic & Mechanical Components The "electronic parts" of this assembly refers to the thermal management system components: ### A. The Heat Sink Body The body is constructed from high-grade aluminum. It uses an **XCUT** fin pattern, which provides maximum surface area while allowing multidirectional airflow. This is critical for cooling densely packed PCB environments. ### B. Push Pin Attachment (Plastic/Brass) Instead of adhesive tapes, this model uses a mechanical push-pin system. * **Purpose:** Ensures consistent pressure (clamping force) against the chip. * **Advantage:** Prevents the heat sink from shifting due to vibration and improves the efficiency of the Thermal Interface Material (TIM). ### C. The Spring Integrated with the push pin is a high-performance spring. The spring constant is calculated to provide the optimal **PSI (pounds per square inch)** to ensure the component does not crack while maintaining perfect contact. ### D. Thermal Interface Material (TIM) The "C2" in the part number indicates that the unit comes with **T766** pre-applied thermal phase-change material. * **Function:** Fills microscopic air gaps between the component die and the heat sink base to maximize heat transfer. --- ## 3. Part Number Breakdown Understanding the nomenclature helps identify its specific electronic application: * **ATS:** Advanced Thermal Solutions. * **17F:** Series identifier. * **202:** Specific geometry and fin density configuration. * **C2:** Indicates the type of Thermal Interface Material (T766) and the finish. * **R0:** Revision code. --- ## 4. Application Use Cases This specific heat sink is typically found in: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Industrial PCs:** Ensuring thermal stability in fanless or low-airflow environments. 3. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.