The part number **ATS-17F-203-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "superGRIP" series, designed for cooling electronic components such as CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Dimension (L x W)** | 54mm x 54mm | | **Height (H)** | 23mm | | **Fin Type** | XC-Cut (Cross-Cut) | | **Attachment Method** | superGRIP (Clip-on) | | **Thermal Resistance** | ~0.80°C/W (at 200 LFM) | | **RoHS Status** | Compliant | --- ### 2. Breakdown of the Part Number The nomenclature for ATS heat sinks provides specific details about the configuration: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **17**: Series number (usually denotes the attachment mechanism or fin profile). * **F**: Denotes the thermal interface material or a specific revision. * **203**: Size code (identifies the 54mm x 54mm footprint). * **C2**: Refers to the "Blue Anodized" finish and specific performance grade. * **R0**: Revision/Packaging code. --- ### 3. Key Electronic Cooling Features #### A. Fin Design (XC-Cut) The **XC-Cut** pattern features straight fins that have been cross-cut. This creates a matrix of pins, which allows for: * **Omnidirectional Airflow:** Air can enter from any direction, making it ideal for systems where the airflow path is not strictly linear. * **Increased Surface Area:** More surface area contact with the air compared to standard straight fins. #### B. Attachment System (superGRIP) This part uses a "superGRIP" frame clip. This is critical for high-density electronic boards because: * **No Holes Required:** It attaches directly to the component (BGA package), eliminating the need to drill holes in the PCB. * **Constant Pressure:** It applies steady, even pressure across the Thermal Interface Material (TIM) for maximum heat transfer. #### C. Thermal Interface Material (TIM) The "C2" variant typically comes with a pre-applied high-performance thermal pad or phase-change material on the base, ensuring minimal thermal resistance between the chip and the aluminum body. --- ### 4. Typical Applications * **Telecommunications:** High-speed routers and switches. * **Computing:** High-end processors and server components. * **Industrial:** Power supplies and motor controllers that generate significant localized heat.