The **ATS-17F-207-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and surface-mount components. --- ### 1. Technical Specifications The part belongs to the **pushPIN™** series, known for its standardized mounting systems. | Specification | Details | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Fin Type** | XCUT (Cross-cut for multi-directional airflow) | | **Dimensions** | 60.00mm x 60.00mm x 12.00mm | | **Thermal Resistance** | 6.39°C/W (Unducted @ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied phase change material) | --- ### 2. Key Features and Design #### A. XCUT Fin Profile Unlike straight-fin heat sinks, the XCUT design uses a cross-cut pattern. This allows the heat sink to capture airflow from multiple directions, making it ideal for systems where airflow is unpredictable or turbulent. #### B. PushPIN™ Mounting System The part uses a specialized mechanical attachment system: * **Compression Springs:** Ensure consistent pressure (Load) across the component for optimal heat transfer. * **Plastic/Brass Pins:** Secure the heat sink to the PCB through pre-drilled holes. * **Reliability:** This system is more reliable than thermal tape or epoxy for high-vibration environments. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the use of **T766 thermal grease/pad**. This material fills the microscopic air gaps between the heat sink base and the chip, significantly lowering the contact resistance. --- ### 3. Application Use Cases This specific heat sink is typically used for cooling: * **Processors (CPUs/GPUs):** Low-profile cooling for embedded systems. * **ASICs/FPGAs:** High-speed chips in networking equipment. * **Power Supplies:** Cooling voltage regulators or power transistors. --- ### 4. Thermal Performance Data Performance varies based on air velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.39 | | 300 (1.5 m/s) | 3.13 | | 500 (2.5 m/s) | 2.31 |