The **ATS-17F-26-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **heat sink** manufactured by Advanced Thermal Solutions (ATS) designed for cooling integrated circuits (ICs) and other electronic components. --- ### Technical Specifications The following table summarizes the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Type** | Top Mount Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 70.00mm x 70.00mm | | **Height (Off Base)** | 10.00mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 14.20°C/W (Unducted @ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### Key Electronic & Mechanical Features #### 1. Heat Sink Design The part uses a **Cross-Cut** fin design. This allows for multi-directional airflow, making it efficient in systems where the direction of the cooling air may be inconsistent or turbulent. #### 2. pushPIN™ Attachment Unlike adhesive tapes or clip-on systems, this part uses a **Push-Pin** mechanism: * **Compression Spring:** Ensures consistent pressure (clamping force) between the heat sink and the electronic component (CPU, FPGA, or GPU). * **Secure Mounting:** Requires pre-drilled holes in the PCB, providing a much more stable mechanical connection than thermal tape. #### 3. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a high-performance phase-change material or grease that fills the microscopic air gaps between the heat sink and the electronic chip, significantly lowering the contact thermal resistance. #### 4. Thermal Efficiency The "C2" in the part number indicates the material/finish grade. With a thermal resistance of **14.20°C/W** at low airflow (100 LFM), it is designed for low-profile applications where height is limited (only 10mm) but a large surface area (70mm x 70mm) is available. --- ### Applications * **Networking Equipment:** High-speed routers and switches. * **Power Supplies:** Cooling MOSFETs or power regulators. * **Embedded Systems:** Industrial PCs and automation controllers. * **Telecommunications:** Base stations and signal processing units.