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  • ATS-17F-27-C2-R0

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    ### Overview of ATS-17F-27-C2-R0 The **ATS-17F-27-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed to provide efficient cooling for electronic components, primarily Integrated Circuits (ICs) and processors. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 70mm x 70mm x 12.7mm | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 12.24°C/W (Unducted Flow @ 200 LFM) | | **Fin Style** | Straight Fin | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. The Fin Design The device uses a **straight-fin** configuration. This is optimized for airflow directed across the board. The 12.7mm height is considered a "low profile" design, making it suitable for compact chassis or server blades where vertical space is limited. #### B. The Push Pin Mechanism Unlike adhesive-based heat sinks, the `-R0` series uses a mechanical push pin system: * **Stability:** Provides consistent pressure on the component. * **Reliability:** Prevents the heat sink from shifting during vibration or shipping. * **Hole Pattern:** Requires specific pre-drilled holes in the PCB. #### C. Thermal Interface Material (T766) The part comes with **T766** pre-applied to the base. T766 is a phase-change material that offers low thermal impedance, ensuring maximum heat transfer between the chip and the aluminum fins. --- ### 3. Application Use Cases This specific part is typically used for: * **BGA (Ball Grid Array) Cooling:** High-speed processors or FPGAs. * **Telecommunications:** Networking equipment (routers/switches). * **Power Supplies:** Cooling voltage regulators or power modules. --- ### 4. Part Number Breakdown * **ATS:** Manufacturer (Advanced Thermal Solutions). * **17F:** Series identifier. * **27:** Specific size/fin geometry code. * **C2:** Material/Finish (Blue Anodized Aluminum). * **R0:** Packaging or revision indicator. ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the push pins used in this heat sink?
    • ⤷ How does the thermal resistance of this model change at higher airflows (e.g.
    • ⤷ 500 LFM)?
    • ⤷ Is there a version of this heat sink available without pre-applied T766 interface material?