ATS-17F-27-C2-R0
AI

### Overview of ATS-17F-27-C2-R0
The **ATS-17F-27-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed to provide efficient cooling for electronic components, primarily Integrated Circuits (ICs) and processors.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions (L x W x H)** | 70mm x 70mm x 12.7mm |
| **Attachment Method** | Push Pin (Plastic/Brass) |
| **Thermal Resistance** | 12.24°C/W (Unducted Flow @ 200 LFM) |
| **Fin Style** | Straight Fin |
| **Spring Type** | Compression Spring |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Key Component Features
#### A. The Fin Design
The device uses a **straight-fin** configuration. This is optimized for airflow directed across the board. The 12.7mm height is considered a "low profile" design, making it suitable for compact chassis or server blades where vertical space is limited.
#### B. The Push Pin Mechanism
Unlike adhesive-based heat sinks, the `-R0` series uses a mechanical push pin system:
* **Stability:** Provides consistent pressure on the component.
* **Reliability:** Prevents the heat sink from shifting during vibration or shipping.
* **Hole Pattern:** Requires specific pre-drilled holes in the PCB.
#### C. Thermal Interface Material (T766)
The part comes with **T766** pre-applied to the base. T766 is a phase-change material that offers low thermal impedance, ensuring maximum heat transfer between the chip and the aluminum fins.
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### 3. Application Use Cases
This specific part is typically used for:
* **BGA (Ball Grid Array) Cooling:** High-speed processors or FPGAs.
* **Telecommunications:** Networking equipment (routers/switches).
* **Power Supplies:** Cooling voltage regulators or power modules.
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### 4. Part Number Breakdown
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **17F:** Series identifier.
* **27:** Specific size/fin geometry code.
* **C2:** Material/Finish (Blue Anodized Aluminum).
* **R0:** Packaging or revision indicator.
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- ⤷
What are the PCB hole diameter requirements for the push pins used in this heat sink?
- ⤷ How does the thermal resistance of this model change at higher airflows (e.g.
- ⤷ 500 LFM)?
- ⤷ Is there a version of this heat sink available without pre-applied T766 interface material?