The **ATS-17F-34-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components that generate heat during operation. Below is a detailed breakdown of its specifications and electronic characteristics. --- ### 1. General Specifications The part belongs to the **Advanced Thermal Solutions (ATS)** "blue ice" high-performance heatsink line. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-17F-34-C3-R0 | | **Type** | Board Level Heatsink | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Material** | Aluminum | | **Finish** | Blue Anodized | --- ### 2. Physical Dimensions Precision in dimensions is critical for ensuring the heatsink fits within the spatial constraints of a PCB layout. * **Length:** 35.00 mm * **Width:** 35.00 mm * **Height (Fin Height):** 25.00 mm * **Pin Pitch:** 40.00 mm (Distance between attachment holes) --- ### 3. Thermal Performance In electronics, thermal resistance ($\theta$) determines how efficiently heat is moved away from the semiconductor junction. Lower numbers indicate better cooling. | Airflow Velocity | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted Flow (@1.0 m/s)** | 6.81 | | **Ducted Flow (@1.0 m/s)** | 1.83 | | **Unducted Flow (@3.5 m/s)** | 2.02 | --- ### 4. Key Electronic Integration Features * **Push-Pin Mounting:** This part uses a specialized push-pin mechanism with a compression spring. This ensures constant, even pressure on the electronic chip, which optimizes the **Thermal Interface Material (TIM)** performance. * **XC (Extra Coarse) Pitch:** The fin design is optimized for "open air" environments where airflow might be inconsistent, making it versatile for various server or industrial enclosures. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T412** thermal tape or grease, which provides a low-resistance path between the component and the aluminum fins. * **Material Compatibility:** Made of aluminum 6063, it is lightweight and does not interfere with the electromagnetic profile of the high-speed signals on the PCB. --- ### 5. Common Applications * **Processors (CPUs/GPUs):** Small form-factor embedded processors. * **FPGAs & ASICs:** High-speed programmable logic devices that generate significant heat. * **Power Supplies:** Cooling MOSFETs or power conversion modules. * **Telecommunications:** Used in routers and switches to maintain signal integrity through temperature control.