The **ATS-17F-35-C3-R0** is a specific electronic component, categorized as a **High-Performance Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* and is part of their "push-pin" attachment series designed for cooling integrated circuits (ICs) and other electronic components. --- ## 1. Technical Specifications The part number provides a roadmap to its physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Attachment Method** | Push-Pin (Plastic) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 12.60°C/W (at 200 LFM) | | **Flow Direction** | Fine-Pitch (Cross-Cut) | | **Dimensions** | 35mm x 35mm x 20mm | --- ## 2. Structural Breakdown ### A. Material and Coating The heat sink is made of **Aluminum 6063**, which offers a high thermal conductivity-to-weight ratio. The **Blue Anodized** finish is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, slightly improving radiant cooling. ### B. Fin Geometry (Cross-Cut) The "F" in the part number indicates a **fine-pitch fin** design. The cross-cut pattern allows for air to flow through the fins from multiple directions, making it more efficient in systems where airflow may be turbulent or non-linear. ### C. Attachment Mechanism (Push-Pin) This part uses a **Plastic Push-Pin** with a **Brass Spring**. * **Purpose:** It ensures a constant, predefined pressure (load) on the processor/chip. * **Stability:** The spring-loaded mechanism prevents the heat sink from shifting during mechanical shock or vibration. --- ## 3. Thermal Performance Comparison Thermal resistance ($R_{th}$) determines how effectively the part moves heat away from the electronics. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 12.60 | | **200 (1.0 m/s)** | 6.11 | | **300 (1.5 m/s)** | 4.50 | | **400 (2.0 m/s)** | 3.64 | --- ## 4. Key Application Use-Cases * **BGA (Ball Grid Array) Cooling:** Typically used for CPUs, GPUs, or FPGAs on embedded systems. * **Telecommunications:** Used in routers and switches where steady airflow is present. * **Industrial Controls:** Cooling power management ICs in high-vibration environments.