The **ATS-17F-49-C3-R0** is a specific electronic component belonging to the thermal management category. It is a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its electronic and mechanical specifications. --- ### 1. Technical Specifications The part is designed for cooling electronic components like CPUs, GPUs, or high-power transistors using a "Push-Pin" mounting mechanism. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance (Flow)** | 5.63°C/W @ 100 LFM (Linear Feet per Minute) | | **Thermal Resistance (Static)** | 2.30°C/W @ 400 LFM | | **Mounting Type** | Push-Pin (Plastic or Brass) | | **Attachment Interface** | Pre-applied Thermal Interface Material (TIM) | --- ### 2. Physical Dimensions Precision in sizing is critical for ensuring the heat sink fits within PCB constraints without interfering with neighboring components. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 10.00 mm (Low profile) * **Pitch (Hole spacing):** 38.00 mm --- ### 3. Key Electronic Cooling Features * **Fine-Pitch Fin Design:** The "F" in the part number often denotes a fine-pitch fin pattern, which provides a larger surface area for heat dissipation in space-constrained environments. * **Advanced Flow Dynamics:** Designed to work efficiently with both natural convection and forced air (fans). * **Thermal Interface Material (TIM):** This part usually comes with **T766** phase-change material or similar, ensuring high thermal conductivity between the component die and the aluminum base. * **Push-Pin Attachment:** Provides a specific, consistent pressure (clamping force) on the electronic chip, which optimizes heat transfer and prevents the heat sink from shifting during vibration. --- ### 4. Typical Applications This component is commonly found in: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** Industrial PCs where vertical space (10mm height) is limited. 3. **Power Electronics:** Dissipating heat from VRMs (Voltage Regulator Modules) or MOSFETs. ---