The **ATS-17F-51-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic packages. It is manufactured by Advanced Thermal Solutions (ATS) as part of their "push pin" series. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-17F-51-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (with Brass Springs) | | **Thermal Resistance** | 6.69°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35mm x 35mm x 20mm | | **Fin Style** | Straight (Square) | --- ### 2. Design and Component Breakdown #### A. Fin Pattern (Cross-Cut) The ATS-17F-51-C2-R0 uses a **straight-fin** design that is often cross-cut. This creates a matrix of pins (pedestals) rather than continuous walls. This design is crucial for: * Increasing surface area for heat dissipation. * Allowing airflow from multiple directions (omnidirectional). #### B. Attachment Mechanism (Push Pins) Instead of adhesive tape or thermal glue, this part uses **plastic or brass push pins**. * **Reliability:** Provides constant pressure (preload) against the chip, improving thermal interface material (TIM) performance. * **Security:** Mechanical attachment ensures the heatsink does not shift during vibration or shipping. #### C. Material and Finish * **AL6063 Aluminum:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Coating:** Provides corrosion resistance and electrical insulation, while slightly improving emissivity for radiative heat transfer. --- ### 3. Application Use Cases This specific heatsink is typically found in the following electronic environments: 1. **Networking Hardware:** Cooling CPUs in routers, switches, and firewalls. 2. **Embedded Systems:** Cooling SoCs (System on Chips) in industrial automation. 3. **Power Electronics:** Managing heat for voltage regulators and power modules. --- ### 4. Thermal Performance Comparison Thermal resistance decreases as airflow (Measured in Linear Feet per Minute - LFM) increases: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 6.69 | | 300 (Moderate) | 2.50 | | 500 (High) | 1.74 |