The **ATS-17F-54-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series, designed for cooling high-power electronic components like CPUs, GPUs, and ASICs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance (LFM 200)** | 6.70 °C/W | | **Thermal Resistance (LFM 700)** | 3.50 °C/W | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | | **Mounting Pattern** | 28.50mm x 28.50mm | --- ### 2. Design Characteristics The part is engineered to maximize surface area while maintaining a compact footprint. Key design elements include: * **Fine Pitch Fin Design:** The "F" in the part number indicates a fine-pitch fin geometry, which provides a high surface area to volume ratio, making it ideal for high-airflow environments. * **pushPIN™ Attachment:** This system replaces traditional adhesives or screw-mounting. It utilizes a pre-assembled brass component and a plastic pin to securely snap the heat sink onto the PCB through pre-drilled holes. * **Pre-Applied Thermal Interface Material (TIM):** Most units in this series come with **T412** or similar phase-change material applied to the base, ensuring minimal thermal resistance between the heat source and the sink. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying specific features: | Code | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **17** | Series number (Internal design classification) | | **F** | Fin pitch (Fine) | | **54** | Dimensions code (Length/Width reference) | | **C2** | Thermal Performance/Material grade | | **R0** | RoHS Compliant / Revision status | --- ### 4. Application Use Cases This specific heat sink is typically found in: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Power Supplies:** Heat dissipation for MOSFETs and Voltage Regulators. 3. **Industrial Automation:** Thermal management for embedded controllers.