The **ATS-17F-72-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (Fin Height)** | 25mm | | **Thermal Resistance** | 5.19°C/W (at 100 LFM) | | **Flow Direction** | XCUT (Omni-directional) | --- ## 2. Key Components & Design Features ### A. The Heat Sink Body * **Material:** Made of high-grade aluminum for a balance of lightweight properties and high thermal conductivity. * **XCUT Fin Design:** This specific "cross-cut" pattern allows air to flow through the fins from any direction. This is ideal for systems where the airflow direction is inconsistent or restricted. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer provides corrosion resistance and slightly improves radiative heat transfer. ### B. The pushPIN™ Attachment System This part uses a specific mounting mechanism instead of thermal adhesive: 1. **Push-Pins:** Plastic or metal pins that snap into pre-drilled holes on the PCB. 2. **Compression Springs:** These provide precise, uniform pressure (Force) across the Thermal Interface Material (TIM), ensuring maximum contact between the chip and the heat sink. ### C. Thermal Interface Material (TIM) * **Pre-applied Interface:** This model typically comes with **T412** thermal tape or a similar phase-change material pre-applied to the base. This eliminates the need for external thermal paste during assembly. --- ## 3. Thermal Performance Summary Thermal resistance indicates how efficiently the part moves heat away from the component. Lower values are better. * **At 100 LFM (Linear Feet per Minute):** 5.19 °C/W * **At 700 LFM:** 1.05 °C/W --- ## 4. Typical Applications * **Embedded Systems:** Industrial PCs and automation controllers. * **Telecommunications:** Network switches and routers. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Consumer Electronics:** High-end audio equipment or gaming peripherals.