The **ATS-17F-77-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic surface-mount components. It belongs to the **push-pin** attachment series manufactured by **Advanced Thermal Solutions (ATS)**. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | push-pin™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25mm x 25mm x 20mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 9.58°C/W (Unducted Flow @ 200 LFM) | | **Pressure Drop** | 0.15 inH2O (@ 200 LFM) | --- ### 2. Key Design Features #### A. Pin-Fin Geometry Unlike traditional straight-fin heatsinks, this model often utilizes a cross-cut or pin-fin design. This increases the surface area and allows for **omnidirectional airflow**, meaning it can dissipate heat effectively regardless of which direction the air is blowing across the PCB. #### B. Push-Pin Attachment The "77" in the part number refers to the specific attachment kit. This system uses: * **Spring-loaded pins:** These provide a precise amount of force (load) onto the component to ensure optimal thermal contact. * **Pre-drilled PCB holes:** The pins snap into holes on the motherboard, making it more secure than adhesive tapes for high-vibration environments. #### C. Thermal Interface Material (TIM) This specific part number usually comes with **T412** thermal tape or a pre-applied phase-change material on the base, ensuring there are no air gaps between the heatsink and the chip. --- ### 3. Applications The ATS-17F-77-C3-R0 is typically used in space-constrained environments where high heat density is an issue, such as: * **Telecommunications:** Network switches and routers. * **Embedded Systems:** High-speed processors and FPGAs. * **Power Supplies:** Cooling MOSFETs or power regulators. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 12.00 | | 200 | 9.58 | | 300 | 8.20 | | 500 | 6.50 |