The **ATS-17F-79-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-17F-79-C3-R0 | | **Heat Sink Type** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25mm x 25mm x 30mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material** | T412 (High performance) | --- ## 2. Design and Component Breakdown ### A. Fin Geometry (Straight Fin) The "79" series features a **straight fin** design. Straight fins are optimized for **forced air cooling** (active airflow from a fan). This design provides a low-pressure drop, allowing air to move through the fins efficiently. ### B. pushPIN™ Attachment System Instead of simple adhesive tape, this unit uses a mechanical **push-pin and spring** assembly. * **Reliability:** Ensures consistent pressure between the heat sink and the component. * **Springs:** Provides a precise "load" to ensure the thermal interface material (TIM) performs at its best without cracking the silicon die. ### C. Thermal Interface Material (TIM) The part comes pre-applied with **T412**. * This is a high-performance thermal grease or pad that fills microscopic air gaps between the component and the heat sink base, significantly reducing thermal resistance. --- ## 3. Thermal Performance Indicators Thermal resistance is measured in °C/W (Degrees Celsius per Watt). Lower values indicate better cooling performance. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 1.0 (Unducted) | ~2.63 | | 2.0 (Unducted) | ~1.58 | | 3.0 (Unducted) | ~1.31 | --- ## 4. Key Application Use-Cases * **Embedded Systems:** Cooling small-form-factor processors. * **Networking Equipment:** High-speed routers and switches. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators in confined spaces. ---