The **ATS-17F-82-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the physical and thermal properties of the device. | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push Pin | | **Thermal Resistance (Flowing)** | 2.50 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 1.15 °C/W (at high air flow) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | --- ### 2. Physical Design Features #### A. Fin Profile (Straight Fin) The **"F"** in the part number denotes a **Straight Fin** design. This pattern is ideal for "high-velocity" air environments where a fan provides a steady stream of air through the channels. #### B. Material and Finish * **Aluminum:** Lightweight and offers excellent thermal conductivity for most commercial applications. * **Blue Anodized:** The coating provides corrosion resistance and increases surface emissivity, which slightly improves radiative cooling. #### C. pushPIN™ Attachment System This specific model utilizes the ATS pushPIN™ system, which includes: * **Spring-loaded mechanism:** Ensures constant pressure between the heat sink and the component for optimal heat transfer. * **Flexible Mounting:** Compatible with a variety of PCB hole patterns. --- ### 3. Thermal Performance Metrics Thermal resistance indicates how efficiently the sink moves heat away from the chip. Lower numbers are better. * **@ 100 LFM (Linear Feet per Minute):** 2.50 °C/W * **@ 500 LFM:** ~1.30 °C/W * **@ 700 LFM:** ~1.15 °C/W --- ### 4. Implementation Checklist If you are integrating this into a PCB design, keep the following in mind: ```markdown 1. Hole Pattern: Ensure your PCB has the matching holes for the push-pin pitch. 2. Thermal Interface Material (TIM): This model typically comes with pre-applied Phase Change Material or T766 thermal tape. 3. Airflow Direction: Align the straight fins with the direction of your system's intake/exhaust fans. ``` ---