ATS-17F-85-C3-R0
AI

The **ATS-17F-85-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" attachment series designed for cooling electronic components like CPUs, GPUs, or high-power transistors.
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## 1. Technical Specifications
The following table summarizes the key physical and thermal properties of the part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | Push-Pin (Plastic) |
| **Thermal Resistance** | 2.54°C/W (at 200 LFM) |
| **Base Dimensions** | 35mm x 35mm |
| **Height** | 10.00mm |
| **Pattern** | 4-Corner Push Pin |
| **Thermal Interface Material (TIM)** | T412 (Pre-applied) |
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## 2. Key Components & Design Features
### A. Material and Finish
* **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties.
* **Blue Anodized Coating:** Provides corrosion resistance and increases surface emissivity, which slightly improves radiant cooling.
### B. Fin Design (Cross-Cut)
The "F" in the part number often signifies a specific fin geometry. The **cross-cut** design allows for multidirectional airflow, making it ideal for systems where air may not be traveling in a single linear path across the PCB.
### C. Attachment System (Push-Pins)
Unlike adhesive tapes or clips, this part uses **plastic push-pins** with integrated springs.
* **Uniform Pressure:** The springs ensure that the heat sink maintains constant, even pressure against the chip.
* **Secure Mounting:** It requires pre-drilled holes in the PCB, offering higher mechanical stability than adhesive-based solutions.
### D. Thermal Interface Material (TIM)
The unit comes with **T412** pre-applied to the base. This is a high-performance phase-change material or foil that fills microscopic air gaps between the heat sink and the electronic component to maximize heat transfer.
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## 3. Performance Data (Airflow)
Thermal performance varies based on the velocity of the air moving through the fins (measured in Linear Feet per Minute - LFM):
* **@ 200 LFM:** 2.54 °C/W
* **@ 400 LFM:** 1.79 °C/W
* **@ 600 LFM:** 1.59 °C/W
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## 4. Part Number Breakdown
The nomenclature follows the standard ATS format:
* **ATS**: Manufacturer (Advanced Thermal Solutions)
* **17**: Series number
* **F**: Fin Type / Geometry
* **85**: Specific footprint/size designation
* **C3**: Thermal Interface Material / Color code
* **R0**: RoHS compliance / Revision code
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What are the PCB hole size requirements for the push-pin mounting on this heat sink?
- ⤷ Can this heat sink be used with a different Thermal Interface Material (TIM) than the pre-applied T412?
- ⤷ How does the cross-cut fin design compare to straight-fin designs in low-airflow environments?