Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-17F-85-C3-R0

  • AI
    The **ATS-17F-85-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" attachment series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications The following table summarizes the key physical and thermal properties of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 2.54°C/W (at 200 LFM) | | **Base Dimensions** | 35mm x 35mm | | **Height** | 10.00mm | | **Pattern** | 4-Corner Push Pin | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ## 2. Key Components & Design Features ### A. Material and Finish * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Coating:** Provides corrosion resistance and increases surface emissivity, which slightly improves radiant cooling. ### B. Fin Design (Cross-Cut) The "F" in the part number often signifies a specific fin geometry. The **cross-cut** design allows for multidirectional airflow, making it ideal for systems where air may not be traveling in a single linear path across the PCB. ### C. Attachment System (Push-Pins) Unlike adhesive tapes or clips, this part uses **plastic push-pins** with integrated springs. * **Uniform Pressure:** The springs ensure that the heat sink maintains constant, even pressure against the chip. * **Secure Mounting:** It requires pre-drilled holes in the PCB, offering higher mechanical stability than adhesive-based solutions. ### D. Thermal Interface Material (TIM) The unit comes with **T412** pre-applied to the base. This is a high-performance phase-change material or foil that fills microscopic air gaps between the heat sink and the electronic component to maximize heat transfer. --- ## 3. Performance Data (Airflow) Thermal performance varies based on the velocity of the air moving through the fins (measured in Linear Feet per Minute - LFM): * **@ 200 LFM:** 2.54 °C/W * **@ 400 LFM:** 1.79 °C/W * **@ 600 LFM:** 1.59 °C/W --- ## 4. Part Number Breakdown The nomenclature follows the standard ATS format: * **ATS**: Manufacturer (Advanced Thermal Solutions) * **17**: Series number * **F**: Fin Type / Geometry * **85**: Specific footprint/size designation * **C3**: Thermal Interface Material / Color code * **R0**: RoHS compliance / Revision code
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole size requirements for the push-pin mounting on this heat sink?
    • ⤷ Can this heat sink be used with a different Thermal Interface Material (TIM) than the pre-applied T412?
    • ⤷ How does the cross-cut fin design compare to straight-fin designs in low-airflow environments?