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  • ATS-17F-86-C3-R0

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    The **ATS-17F-86-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling integrated circuits (ICs) and other PCB-mounted components. --- ### 1. Technical Specifications Below are the primary mechanical and thermal specifications for this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Fin Style** | XC (Extra Coarse) Square Fin | | **Dimensions (L x W)** | 35.00 mm x 35.00 mm | | **Height (H)** | 10.00 mm | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 17.85 °C/W (Unducted Flow @ 100 LFM) | | **Finish** | Blue Anodized | | **Interface Material** | T412 (Phase Change Material / Thermal Pad) | --- ### 2. Component Composition The part consists of four main electronic packaging elements: 1. **Heat Sink Body:** A square-fin aluminum block that increases surface area for heat dissipation. The "XC" pattern indicates a grid of square pins (cross-cut), allowing airflow from any direction (omnidirectional). 2. **Push-Pin Attachment:** A mechanical fastening system consisting of two plastic or metal pins. This eliminates the need for adhesives or complicated mounting hardware. 3. **Compression Spring:** Located on the push-pins, these ensure constant and even pressure between the heat sink and the electronic component (CPU, GPU, or FPGA), maximizing thermal transfer. 4. **Thermal Interface Material (TIM):** The **T412** coating is pre-applied to the base. This material fills microscopic air gaps between the chip and the heat sink. --- ### 3. Thermal Performance (C/W) Thermal resistance is critical in electronics to prevent "thermal throttling" or component failure. The lower the °C/W value, the better the cooling. | Airflow Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | 600 | 700 | | :--- | :--- | :--- | :--- | :--- | :--- | :--- | :--- | | **Unducted Flow** | 17.85 | 11.59 | 8.80 | 7.35 | 6.42 | 5.75 | 5.25 | | **Ducted Flow** | 7.03 | 5.10 | 4.31 | 3.82 | 3.48 | 3.22 | 3.02 | --- ### 4. Part Number Decoder The part number follows a specific logic used by ATS: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **17:** Specific series or design iteration. * **F:** Fin pitch/type. * **86:** Dimension/Size code. * **C3:** Material/Thermal performance grade. * **R0:** Revision code (Blue Anodized finish). ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between ducted and unducted flow for this heat sink?
    • ⤷ Is the T412 thermal interface material conductive or non-conductive?
    • ⤷ How do I calculate if this heat sink is sufficient for a 10W chip?