The **ATS-17F-87-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ## 🛠️ Technical Specifications | Feature | Details | | :--- | :--- | | **Part Number** | ATS-17F-87-C3-R0 | | **Category** | Thermal Management - Heat Sinks | | **Material** | Aluminum (Anodized Blue) | | **Fin Style** | Straight Fin (push-pin mount) | | **Dimensions** | 35mm x 35mm x 20mm | | **Thermal Resistance** | 13.30°C/W (at 200 LFM) | | **Attachment Method** | push-pin with compression spring | --- ## 🔍 Key Components & Design ### 1. The Heat Sink Body The body is made of high-grade aluminum. Aluminum is chosen for its excellent thermal conductivity-to-weight ratio. The **Anodized Blue** finish is not just for aesthetics; it provides surface protection and slightly improves radiation heat transfer. ### 2. Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, this part uses **brass push-pins** with high-tension springs. * **Security:** Provides a consistent "mating force" to ensure the heat sink stays in contact with the chip. * **Thermal Interface:** It requires a pre-drilled hole in the PCB (Printed Circuit Board). ### 3. Thermal Interface Material (TIM) The "C3" in the part number indicates the presence of a specific **Thermal Interface Material** (usually a phase-change material or high-performance pad) pre-applied to the base. This fills microscopic air gaps between the component and the heat sink. --- ## 📊 Performance Breakdown The cooling efficiency of this part depends heavily on the airflow (LFM - Linear Feet per Minute): | Airflow Rate (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted (Natural)** | 13.30 | | **200 LFM** | 6.70 | | **400 LFM** | 4.80 | | **600 LFM** | 3.70 | --- ## 🚀 Application Use Cases * **Embedded Systems:** Industrial PCs where vibration resistance (provided by push-pins) is required. * **Networking Gear:** Cooling chips in routers and switches. * **Power Electronics:** Dissipating heat from VRMs (Voltage Regulator Modules).