The **ATS-17F-88-C2-R0** is a high-performance thermal management solution, specifically a **Heat Sink**, manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, known for its high-efficiency cooling in constrained environments. --- ## 1. Technical Specifications The following table outlines the key physical and thermal parameters of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Base Dimensions** | 40mm x 40mm | | **Height** | 19mm | | **Attachment Method** | pushPIN™ (Brass pins / Steel springs) | | **Thermal Resistance** | 2.30° C/W (at 200 LFM) | | **Flow Direction** | Undirected (Optimized for multiple directions) | --- ## 2. Key Electronic & Physical Components ### A. maxiFLOW™ Fin Design The fin geometry is designed to maximize surface area and improve airflow turbulence. Unlike traditional straight-fin heat sinks, these fins are flared to reduce pressure drop and improve heat dissipation from the electronic component to the ambient air. ### B. pushPIN™ Attachment System This is a critical mechanical part of the assembly. It replaces traditional adhesives or clips with a robust spring-loaded pin system. * **Springs:** Provide precise compression (load) to ensure optimal interface between the heat sink and the chip. * **Pins:** Brass or plastic pins that lock into pre-drilled holes in the PCB. ### C. Thermal Interface Material (TIM) The part usually comes with a pre-applied **Phase Change Material (PCM)** or a thermal pad on the base. This fills microscopic air gaps between the semiconductor (CPU/FPGA) and the aluminum base to reduce thermal resistance. --- ## 3. Applications This specific part is commonly used for cooling mid-range heat-generating components: 1. **Network Switches/Routers:** Cooling ASICs and high-speed processors. 2. **Embedded Systems:** Industrial PCs where vertical space is limited to 19mm. 3. **Power Electronics:** Dissipating heat from MOSFET arrays or voltage regulators. --- ## 4. Thermal Performance Data Performance varies based on the air velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 4.77 | | 200 | 2.30 | | 400 | 1.45 | | 600 | 1.10 |