The **ATS-17F-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, designed to provide low thermal resistance and high reliability for cooling semiconductors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-17F-91-C3-R0 | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Pitch** | 1.14mm (Fine Pitch) | | **Thermal Resistance** | 21.97 °C/W (Unducted @ 100 LFM) | | **Thermal Interface Material** | T412 (Phase Change Material) | --- ### 2. Key Components & Features #### A. Thermal Interface Material (TIM) The "C3" in the part number indicates that the heat sink comes pre-applied with **T412**. This is a high-performance thermal pad/paste that ensures maximum heat transfer between the electronic component (CPU, FPGA, etc.) and the aluminum heat sink by filling microscopic air gaps. #### B. pushPIN™ Attachment Unlike simple adhesive tapes, this part uses the **pushPIN™** system. - It includes a **compression spring** to provide precise, uniform pressure. - This ensures better thermal contact and prevents the heat sink from shifting during mechanical shock or vibration. #### C. maxiFLOW™ Fin Design The geometry of the fins is engineered to increase the surface area while minimizing the pressure drop. This allows air to flow through the fins more efficiently, which is critical for components packed closely on a PCB. --- ### 3. Usage in Electronics This specific part is typically used to cool: - **ASICs & FPGAs:** Used in networking and telecommunications equipment. - **Processors:** Small form-factor CPUs or embedded controllers. - **Power Electronics:** High-density power supplies requiring active or passive cooling. ---