The **ATS-17G-142-C2-R0** is a high-performance **Heat Sink** assembly designed by Advanced Thermal Solutions (ATS). It is specifically engineered for cooling electronic components such as CPUs, GPUs, FPGAs, and ASICs. ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | | **Attachment Type** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | ~10.02 °C/W (at 1.0 m/s airflow) | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### 2. Key Electronic Components & Features While the heat sink itself is mechanical, its "electronic" relevance lies in how it integrates with a Printed Circuit Board (PCB): * **Thermal Interface Material (TIM):** The "C2" in the part number indicates the use of **T766** thermal grease. This is a high-performance material that fills microscopic air gaps between the electronic chip and the heat sink to ensure maximum heat transfer. * **Push-Pin Mounting:** Unlike adhesive-based sinks, this uses a spring-loaded push-pin mechanism. This provides **consistent pressure** across the electronic package, which is critical for preventing mechanical stress on the solder balls of BGA (Ball Grid Array) components. * **Fin Design (Mini-Fan):** The "17G" series typically uses a fine-pitch straight fin or cross-cut design to optimize airflow from system fans, ensuring that the junction temperature ($T_j$) of the electronic component remains within safe operating limits. --- ### 3. Part Number Breakdown Understanding the coding helps in selecting the correct thermal solution: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions | | **17G** | Series/Geometry type | | **142** | Specific dimension/fin configuration code | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliant / Revision code | --- ### 4. Application Use Case This specific size (30mm x 30mm) is commonly used for: 1. **Network Switches:** Cooling PHY chips or small processors. 2. **Industrial PCs:** Thermal management for embedded controllers. 3. **Power Electronics:** Dissipating heat from MOSFET arrays or voltage regulators.