The **ATS-17G-147-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the **maxiFLOW™** series, specifically designed for cooling electronic components like processors, FPGAs, and ASICs. Below is the detailed breakdown of its specifications and electronic application. ### 1. General Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 1.35°C/W (at 200 LFM) | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the part fits onto a Printed Circuit Board (PCB) without interfering with surrounding components. | Dimension | Value (mm) | | :--- | :--- | | **Length (A)** | 30.00 mm | | **Width (B)** | 30.00 mm | | **Height (C)** | 10.00 mm | | **Pin Pitch (E)** | 35.00 mm | | **Pin Pitch (F)** | 35.00 mm | --- ### 3. Key Electronic Features * **High Performance Fin Design:** The maxiFLOW™ design features a graduated fin pattern that maximizes surface area and increases airflow efficiency. * **pushPIN™ Attachment:** This model uses a plastic or brass push-pin mechanism with a specific compression spring. This provides a precise, consistent pressure (preload) on the electronic chip, which optimizes thermal interface material (TIM) performance. * **Blue Anodized Coating:** The finish is not just aesthetic; it increases thermal emissivity and provides a layer of protection against environmental corrosion. * **Thermal Interface Material (TIM):** This part typically comes pre-applied with **ATS-PPS-02**, a high-conductivity thermal pad that bridges the gap between the chip surface and the heat sink base. --- ### 4. Thermal Performance Data Performance varies based on the velocity of the air (measured in Linear Feet per Minute - LFM) moving through the system: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 1.35 | | **300 (1.5 m/s)** | 1.15 | | **400 (2.0 m/s)** | 1.05 | | **500 (2.5 m/s)** | 0.95 | --- ### 5. Application Compatibility This heat sink is intended for: 1. **BGA Packages:** Ideally sized for 30mm x 30mm Ball Grid Array chips. 2. **Low Profile Requirements:** With a height of only 10mm, it is suitable for 1U servers or compact embedded systems. 3. **Harsh Environments:** The secure pushPIN™ attachment ensures the heat sink stays in place during high vibration or shock (common in industrial or automotive electronics).