Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-17G-22-C2-R0

  • AI
    The **ATS-17G-22-C2-R0** is a specific electronic cooling component, categorized as a **High-Performance Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to their "blue ICE" series. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 54.00 mm x 54.00 mm | | **Height** | 12.70 mm | | **Thermal Resistance** | 13.87 °C/W (at 1.0 m/s flow) | | **Fin Pattern** | Fine Pitch (Square) | --- ## 2. Component Composition This part is not an active electronic component (like an IC or transistor), but a **passive thermal management component**. Its design includes: ### A. Heat Sink Body * **Material:** Extruded aluminum (6063) for high thermal conductivity. * **Design:** A "cross-cut" or square fin design which allows for multi-directional airflow, making it versatile for different PCB orientations. ### B. The pushPIN™ Attachment System * **Function:** Instead of using messy thermal adhesives or complex screws, this part uses pre-assembled push-pins and springs. * **Benefit:** Provides consistent pressure (clamping force) across the interface, which improves thermal transfer and makes it easy to install/remove during maintenance. ### C. Thermal Interface Material (TIM) * **Standard Feature:** The "-R0" designation typically implies the inclusion of a pre-applied high-performance thermal interface material (like a phase-change material or thermal pad) on the base to fill microscopic gaps between the heat sink and the chip. --- ## 3. Typical Applications This specific part is used to cool integrated circuits that generate moderate to high heat in space-constrained environments: * **Microprocessors (CPUs) and FPGAs.** * **Network Switches and Routers.** * **High-speed Video/Graphics processing units.** * **Industrial Power Supplies.** --- ## 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **17G:** Product series/family code. * **22:** Specific model identifier. * **C2:** Material/Thermal performance code (usually denotes Blue Anodized finish). * **R0:** Revision or packaging code.
    ✨ Follow-up Questions
    • ⤷ What is the difference between push-pin and clip-on heat sink attachments?
    • ⤷ How do I calculate if the 13.87 \u00b0C/W thermal resistance is sufficient for my chip?
    • ⤷ Are there low-profile variants of the ATS-17G series for slim enclosures?