The **ATS-17G-29-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their **maxiFLOW™** series of high-performance heat sinks designed for cooling integrated circuits (ICs) and other electronic components. --- ## 1. Technical Specifications This part is a thermal management solution characterized by its high-density fin structure and specific material properties. | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance (Flowing Air)** | 7.57 °C/W @ 100 LFM | | **Thermal Resistance (Static Air)** | 15.31 °C/W | | **Dimensions (L x W x H)** | 45mm x 40mm x 20mm | --- ## 2. Key Components & Construction The "Electronic Part" in this context is passive, meaning it does not require electricity to operate but is essential for the electrical integrity of active components (like CPUs or FPGAs). ### A. The Heat Sink Body * **Fin Design:** Uses a high-aspect-ratio fin design to maximize surface area within a small footprint. * **Material:** Made from aluminum, which provides a balance between high thermal conductivity and low weight. * **Finish:** Blue Anodized. This is not just for aesthetics; the anodized layer provides corrosion resistance and improved emissivity. ### B. Attachment Mechanism (pushPIN™) The part uses a specialized mounting system consisting of: * **Nylon/Brass Pins:** To secure the heat sink to the PCB. * **Compression Springs:** These provide precise, uniform pressure (Pre-assembled) across the component surface to ensure optimal thermal contact. ### C. Thermal Interface Material (TIM) * Usually comes pre-applied with **T766** or a similar phase-change material on the base to fill microscopic air gaps between the heat sink and the chip. --- ## 3. Part Number Decoding (ATS-17G-29-C2-R0) | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **17** | Specific Series/Configuration Identifier | | **G** | Attachment Type (e.g., pushPIN™) | | **29** | Specific Dimension/Height code | | **C2** | Thermal Performance/Material Grade | | **R0** | RoHS Compliant / Revision Number | --- ## 4. Application This component is typically found in: * **Telecommunications:** Cooling networking switches and routers. * **Computing:** Protecting high-speed processors or chipsets. * **Industrial:** Managing heat in power supplies or motor controllers.