Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-17G-33-C2-R0

  • AI
    The **ATS-17G-33-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for high-density electronic cooling applications. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Specification | Details | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Fin Type** | Fine-Pitch | | **Thermal Resistance (Unducted)** | 17.42 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 2.67 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 35mm x 35mm x 20mm | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the physical and thermal characteristics: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **17G**: Series/Family identifier. * **33**: Specific size code (corresponds to the 35mm footprint). * **C2**: Thermal Performance/Material Grade (Blue Anodized AL6063). * **R0**: Revision or standard packaging code. --- ### 3. Key Electronic Components Features #### A. Thermal Performance The "Fine-Pitch" design increases the surface area available for heat dissipation. This makes it ideal for cooling high-performance processors (CPUs), ASICs, or FPGAs where space is limited but heat generation is high. #### B. PushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses a mechanical PushPIN™ system: * **Spring-loaded mechanism:** Ensures consistent pressure across the interface material (TIM). * **Reliability:** Prevents the heat sink from shifting during vibration or shipping. * **Easy Installation:** Requires pre-drilled holes in the PCB. #### C. Environmental Resistance The **Blue Anodized finish** is not just for aesthetics; it provides: * Corrosion resistance. * Increased surface emissivity (improving radiative heat transfer). * Electrical insulation of the aluminum surface. --- ### 4. Application Usage This part is typically found in: * **Networking Equipment:** Routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** High-density DC-DC converters. ---
    ✨ Follow-up Questions
    • ⤷What are the PCB hole requirements for the pushPIN™ attachment system?
    • ⤷ How does the Blue Anodized finish compare to Black Anodized in terms of thermal performance?
    • ⤷ Can this heat sink be used with a custom Thermal Interface Material (TIM)?