The **ATS-17G-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to Printed Circuit Boards (PCBs). ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-17G-35-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass) | | **Base Dimensions** | 35mm x 35mm | | **Height** | 10mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 12.83°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Core Electronic Components & Design #### 1. The Heat Sink Body The body is constructed from **Aluminum**. Aluminum is used in electronics because of its high thermal conductivity and lightweight properties. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiant heat transfer. #### 2. Attachment Mechanism (Push-Pins) Unlike adhesive-based heat sinks, this model uses **Brass Push-Pins** with steel springs. * **Reliability:** Mechanical fasteners provide a consistent downward force (pressure), ensuring the thermal interface remains effective even under mechanical vibration. * **Ease of Assembly:** The push-pins allow for quick installation into pre-drilled holes on the PCB. #### 3. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. * **Function:** In electronics, microscopic air gaps between the component (CPU/GPU/FPGA) and the heat sink act as insulators. The T766 TIM fills these gaps to ensure maximum heat transfer from the silicon to the aluminum fins. #### 4. Fin Geometry The **Straight Fin** design is optimized for "Open Flow" or "Steady State" airflow environments. The 10mm height makes it a "low-profile" component, suitable for compact electronic enclosures where vertical space is limited. --- ### Typical Applications This part is commonly found in the following electronic sectors: * **Telecommunications:** Cooling for network switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Cooling for MOSFETs or high-speed voltage regulators.